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13 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
636
In-stock
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Leader Tech Inc. | 0.03 X 0.15 X 040 BD 16--TWIST C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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2,416
In-stock
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Leader Tech Inc. | 0.03 X 0.15 X 070 BD 16--TWIST C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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1,579
In-stock
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Leader Tech Inc. | 0.03 X 0.15 X 040 BD 16--TWIST C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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2,579
In-stock
|
Leader Tech Inc. | 0.03 X 0.15 X 070 BD 16--TWIST C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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832
In-stock
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Leader Tech Inc. | 0.03 X 0.23 BD 24 NTP--3-S-23T-B | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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2,777
In-stock
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Leader Tech Inc. | 0.03 X 0.23 BD 12.0--3-23T-BD-12 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 12.000" (304.80mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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2,119
In-stock
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Leader Tech Inc. | 0.03 X 0.23 BD 24--TWIST RIGHT A | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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2,837
In-stock
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Leader Tech Inc. | 0.03 X 0.23 BD 24--3-S-23T-BD-24 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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627
In-stock
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Leader Tech Inc. | 0.03 X 0.23 BD 24 NTP--3-23T-BD- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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3,201
In-stock
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Leader Tech Inc. | 0.03 X 0.23 BD 24--3-23T-BD-24-- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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3,781
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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626
In-stock
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Leader Tech Inc. | 0.03 X 0.23 BD 10.0--3-23T-BD-10 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.030" (0.76mm) | 10.000" (254.00mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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3,622
In-stock
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Laird Technologies EMI | TWT COIL BF USF PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
