Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
1,663
In-stock
Laird Technologies EMI S3,STR,SNSAT,USFT,RIV - Active Beryllium Copper 121°C Fingerstock 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
2,302
In-stock
Leader Tech Inc. 0.11 X 0.35 SN 15 NTP--11-35DT-S - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin Flash Adhesive
Default Photo
RFQ
2,121
In-stock
Leader Tech Inc. 0.11 X 0.354 SN 15--11-S-35DTS-S - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin Flash Adhesive
Default Photo
RFQ
878
In-stock
Leader Tech Inc. 0.11 X 0.35 SN 15--11-35DT-SN-15 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin Flash Adhesive
Default Photo
RFQ
1,171
In-stock
Laird Technologies EMI S3,STR,SNB,PSA - Active Beryllium Copper 121°C Fingerstock 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,904
In-stock
Leader Tech Inc. 0.11 X 0.354 BD 15.40--11-S-35DT - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 15.000" (381.00mm) 0.350" (8.89mm) Tin Flash Adhesive