Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
2,733
In-stock
Leader Tech Inc. 0.09 X 0.78 SN 16--9-78D-SN-16-- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.090" (2.29mm) 16.000" (406.40mm) 0.780" (19.81mm) Tin Flash Adhesive
Default Photo
RFQ
1,982
In-stock
Laird Technologies EMI AP,STR,SNB,PSA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,761
In-stock
Laird Technologies EMI AP,STR,SNSAT,PSA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
3,336
In-stock
Leader Tech Inc. 0.25 X 0.78 SN 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Tin Flash Adhesive
Default Photo
RFQ
2,183
In-stock
Leader Tech Inc. 0.25 X 0.78 X 0.50 SN 24--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Tin Flash Adhesive
Default Photo
RFQ
2,468
In-stock
Leader Tech Inc. 0.32 X 0.78 SN 16--32-78AH-SN-16 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.320" (8.13mm) 16.000" (406.40mm) 0.780" (19.81mm) Tin Flash Adhesive
Default Photo
RFQ
2,347
In-stock
Leader Tech Inc. 0.32 X 0.78 SN 16--32-S-78AH-SN- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.320" (8.13mm) 16.000" (406.40mm) 0.780" (19.81mm) Tin Flash Adhesive
Default Photo
RFQ
1,890
In-stock
Laird Technologies EMI AP,STR,SNB,RA - Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 12.000" (304.80mm) 0.780" (19.81mm) Tin 299.21µin (7.60µm) Adhesive