Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
604
In-stock
Leader Tech Inc. 0.25 X 0.78 X 0.50 SU 24--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
926
In-stock
Leader Tech Inc. 0.25 X 0.78 SU 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
1,429
In-stock
Leader Tech Inc. 0.25 X 0.78 BD 85.875 NTP--FOLDE - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 7.16 (2.18m) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
2,435
In-stock
Leader Tech Inc. 0.125 X 0.78 BD 16--11-78R2-BD-1 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.130" (3.30mm) 16.000" (406.40mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
785
In-stock
Leader Tech Inc. 0.09 X 0.78 BD 16--9-78D-BD-16-- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.090" (2.29mm) 16.000" (406.40mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
1,562
In-stock
Leader Tech Inc. 0.09 X 0.78 BD 16--9-78D-A-BD-16 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.090" (2.29mm) 16.000" (406.40mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
3,026
In-stock
Leader Tech Inc. 0.25 X 0.78 BD 300"--FOLDED SERI - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 25.00 (7.62m) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
3,047
In-stock
Leader Tech Inc. 0.25 X 0.78 BD 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
1,693
In-stock
Leader Tech Inc. 0.25 X 0.78 BD 24--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
1,204
In-stock
Leader Tech Inc. 0.25 X 0.78 X 0.50 BD 24--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
3,618
In-stock
Leader Tech Inc. 0.25 X 0.78 X 0.50 BD 24--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
3,844
In-stock
Leader Tech Inc. 0.32 X 0.78 BD 16--32-S-78AH-BD- - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.320" (8.13mm) 16.000" (406.40mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
3,363
In-stock
Leader Tech Inc. 0.32 X 0.78 BD 16--32-78AH-BD-16 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.320" (8.13mm) 16.000" (406.40mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
3,988
In-stock
Leader Tech Inc. 0.32 X 0.78 BD 18--32-78AH-BD-18 - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.320" (8.13mm) 18.000" (457.20mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
981
In-stock
Laird Technologies EMI AP COIL BF PSA All-Purpose Active Beryllium Copper 121°C Fingerstock 0.250" (6.35mm) 24.000" (609.60mm) 0.780" (19.81mm) Unplated Adhesive
Default Photo
RFQ
2,191
In-stock
Leader Tech Inc. 0.25 X 0.78 BD 47.625 NTP--FOLDE - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.250" (6.35mm) 3.97 (1.21m) 0.780" (19.81mm) Unplated Adhesive