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22 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
1,814
In-stock
|
Laird Technologies EMI | AP,STR,SNPB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
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1,583
In-stock
|
Laird Technologies EMI | AP,STR,CDY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
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604
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 X 0.50 SU 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
|
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926
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 SU 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
|
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2,697
In-stock
|
Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
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1,429
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 85.875 NTP--FOLDE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 7.16 (2.18m) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
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3,026
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
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1,871
In-stock
|
Laird Technologies EMI | AP,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
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1,982
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
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1,761
In-stock
|
Laird Technologies EMI | AP,STR,SNSAT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,191
In-stock
|
Laird Technologies EMI | AP,STR,BF,USF,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
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3,336
In-stock
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Leader Tech Inc. | 0.25 X 0.78 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive | ||||
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2,183
In-stock
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Leader Tech Inc. | 0.25 X 0.78 X 0.50 SN 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive | ||||
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3,047
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
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1,693
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
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1,204
In-stock
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Leader Tech Inc. | 0.25 X 0.78 X 0.50 BD 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
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3,618
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 X 0.50 BD 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
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3,105
In-stock
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Laird Technologies EMI | GASKET BECU 19.81X609.6MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
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981
In-stock
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Laird Technologies EMI | AP COIL BF PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
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1,716
In-stock
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Laird Technologies EMI | AP,STR,NIB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 12.000" (304.80mm) | 0.780" (19.81mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,890
In-stock
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Laird Technologies EMI | AP,STR,SNB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 12.000" (304.80mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,191
In-stock
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Leader Tech Inc. | 0.25 X 0.78 BD 47.625 NTP--FOLDE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 3.97 (1.21m) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
