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16 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
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1,848
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Unplated | Adhesive | ||||
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2,885
In-stock
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Laird Technologies EMI | CSTR COIL BF USF | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
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2,321
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | Adhesive | ||||
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1,980
In-stock
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Laird Technologies EMI | AP COIL BF USFT PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | Adhesive | ||||
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2,470
In-stock
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Laird Technologies EMI | CSTR COIL BF USF | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Unplated | Adhesive | ||||
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2,584
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | Adhesive | ||||
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1,535
In-stock
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Laird Technologies EMI | GASKET ULTRASOFT 8.1MMX7.6M | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Unplated | Slot | ||||
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3,805
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | Adhesive | ||||
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3,260
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | Adhesive | ||||
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3,286
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Unplated | Adhesive | ||||
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3,592
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | Adhesive | ||||
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2,250
In-stock
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Laird Technologies EMI | AP COIL BF USFT PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Unplated | Adhesive | ||||
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3,642
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | Adhesive | ||||
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3,781
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
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981
In-stock
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Laird Technologies EMI | AP COIL BF PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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3,622
In-stock
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Laird Technologies EMI | TWT COIL BF USF PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | Adhesive | ||||
