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19 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
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1,814
In-stock
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Laird Technologies EMI | AP,STR,SNPB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,740
In-stock
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Laird Technologies EMI | CSTR COIL ZNY | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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1,583
In-stock
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Laird Technologies EMI | AP,STR,CDY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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2,885
In-stock
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Laird Technologies EMI | CSTR COIL BF USF | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
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1,576
In-stock
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Laird Technologies EMI | CSTR COIL NIB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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3,976
In-stock
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Laird Technologies EMI | CSTR COIL NIE | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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1,369
In-stock
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Laird Technologies EMI | CSTR COIL SNB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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2,697
In-stock
|
Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
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2,973
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 24MMX406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 0.375" (9.53mm) | 0.940" (23.88mm) | - | - | Hardware, Rivet, Solder | ||||
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2,088
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder | ||||
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1,871
In-stock
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Laird Technologies EMI | AP,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,982
In-stock
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Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,761
In-stock
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Laird Technologies EMI | AP,STR,SNSAT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,191
In-stock
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Laird Technologies EMI | AP,STR,BF,USF,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
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3,105
In-stock
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Laird Technologies EMI | GASKET BECU 19.81X609.6MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
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981
In-stock
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Laird Technologies EMI | AP COIL BF PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
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1,716
In-stock
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Laird Technologies EMI | AP,STR,NIB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 12.000" (304.80mm) | 0.780" (19.81mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,890
In-stock
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Laird Technologies EMI | AP,STR,SNB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 12.000" (304.80mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,346
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 27.69MMX406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder | ||||
