- Applied Filters :
17 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
|
3,105
In-stock
|
Laird Technologies EMI | TWT COIL NIE PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,298
In-stock
|
Laird Technologies EMI | TWT COIL SNB USF PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,648
In-stock
|
Laird Technologies EMI | TWT COIL SNSAT USFT PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,822
In-stock
|
Laird Technologies EMI | TWT COIL SNB PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,569
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 8.64X609.6MM | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,347
In-stock
|
Laird Technologies EMI | FINGERSTCK ULTRASFT 8.64X609.6MM | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | - | - | ||||
|
755
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 8.64X609.6MM | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | - | Adhesive | ||||
|
3,286
In-stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | ||||
|
|
2,991
In-stock
|
Laird Technologies EMI | TWT,STR,NIB,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,095
In-stock
|
Laird Technologies EMI | TWT,STR,ZNC,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,580
In-stock
|
Laird Technologies EMI | TWT,STR,SNSAT,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
711
In-stock
|
Laird Technologies EMI | TWT COIL SNSAT PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,839
In-stock
|
Laird Technologies EMI | TWT,STR,NIE,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,381
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,USFT | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | - | Adhesive | ||||
|
|
1,420
In-stock
|
Laird Technologies EMI | TWT,STR,NIB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,602
In-stock
|
Laird Technologies EMI | TWT,STR,ZNC,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,156
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
