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  4. RFI and EMI - Contacts, Fingerstock and Gaskets
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44 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Shape Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
11-28FS-CDC-16
RFQ
2,272
In-stock
 Leader Tech Inc. 0.11 X 0.28 CDC 16--FOLDED SERIE - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Cadmium + Clear Chromate Flash Adhesive
Default Photo
13-28U-MAG-16
RFQ
1,527
In-stock
 Leader Tech Inc. 0.13 X 0.281 MAG 16--13-28U-MAG- - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.130" (3.30mm) 16.000" (406.40mm) 0.280" (7.11mm) Silver Flash Adhesive
Default Photo
11-28RH-BD-16
RFQ
2,830
In-stock
 Leader Tech Inc. 0.11 X 0.28 BD 16--11-28RH-BD-16 - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
Default Photo
SG060280R-23.62
RFQ
3,932
In-stock
 Leader Tech Inc. EMI FABRIC GASKET 1.52X7.11MM - Active Polyurethane Foam, Nickel-Copper Ripstop (NI/CU) -40°C ~ 70°C Fabric Over Foam Rectangular 0.060" (1.52mm) 23.62" (599.95mm) 0.280" (7.11mm) - - Non-Conductive Adhesive
Default Photo
0C98054002
RFQ
1,980
In-stock
 Laird Technologies EMI AP COIL BF USFT PSA All-Purpose Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
Default Photo
11-S-28FS-NI-16
RFQ
1,143
In-stock
 Leader Tech Inc. 0.11 X 0.28 NI 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
0097013502
0097013502
RFQ
2,302
In-stock
 Laird Technologies EMI FINGERSTOCK BECU 7.11X406.4MM - Active - - - - - 16.000" (406.40mm) 0.280" (7.11mm) - - -
0077008102
0077008102
RFQ
3,798
In-stock
 Laird Technologies EMI GASKET BECU 7.11X609.6MM No Snag Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 24.000" (609.60mm) 0.280" (7.11mm) - - Adhesive
0097052702
0097052702
RFQ
3,810
In-stock
 Laird Technologies EMI GASKET BECU 7.11X406.4MM - Active Beryllium Copper 121°C Fingerstock - 0.055" (1.40mm) 16.000" (406.40mm) 0.280" (7.11mm) - - Adhesive
Default Photo
11-S-28FSV23-NI-16
RFQ
871
In-stock
 Leader Tech Inc. 0.11 X 0.28 X 0.24 NI 16.0--FOLD - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
Default Photo
11-S-28FS-SN-16
RFQ
3,420
In-stock
 Leader Tech Inc. 0.11 X 0.28 SN 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin Flash Adhesive
Default Photo
11-28FS-NI-16
RFQ
1,348
In-stock
 Leader Tech Inc. 0.11 X 0.28 NI 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
Default Photo
11-28FS-SN-16
RFQ
3,517
In-stock
 Leader Tech Inc. 0.11 X 0.28 SN 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin Flash Adhesive
Default Photo
11-S-28FSV23-SN-16
RFQ
2,921
In-stock
 Leader Tech Inc. 0.11 X 0.28 X 0.24 SN 16.0--FOLD - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin Flash Adhesive
Default Photo
0097054021
RFQ
2,621
In-stock
 Laird Technologies EMI AP,STR,SU,PSA - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) - - Adhesive
Default Photo
11-28FSV23-SN-16
RFQ
3,993
In-stock
 Leader Tech Inc. 0.11 X 0.28 X 0.23 SN 16--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin Flash Adhesive
Default Photo
0097052717
RFQ
3,857
In-stock
 Laird Technologies EMI AP,STR,SNB,PSA - Active Beryllium Copper 121°C Fingerstock - 0.055" (1.40mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin 299.21µin (7.60µm) Adhesive
Default Photo
11-S-28FS-BD-16
RFQ
3,609
In-stock
 Leader Tech Inc. 0.11 X 0.28 BD 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
0097054002
0097054002
RFQ
3,324
In-stock
 Laird Technologies EMI GASKET BECU 7.11X406.4MM - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) - - Adhesive
Default Photo
0097054019
RFQ
2,928
In-stock
 Laird Technologies EMI AP,STR,NIB,PSA - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
0097054018
RFQ
3,451
In-stock
 Laird Technologies EMI AP,STR,NIE,PSA - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
0097054016
RFQ
3,297
In-stock
 Laird Technologies EMI AP,STR,ZNY,PSA - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Zinc + Yellow Chromate 299.21µin (7.60µm) Adhesive
Default Photo
0097054015
RFQ
1,055
In-stock
 Laird Technologies EMI AP,STR,ZNC,PSA - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Zinc + Clear Chromate 299.21µin (7.60µm) Adhesive
Default Photo
0097054009
RFQ
3,991
In-stock
 Laird Technologies EMI AP,STR,NID,PSA - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
11-S-28FSV23-BD-16
RFQ
3,640
In-stock
 Leader Tech Inc. 0.11 X 0.28 X 0.24 BD 16.0--FOLD - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
Default Photo
11-28FS-BD-16
RFQ
2,671
In-stock
 Leader Tech Inc. 0.11 X 0.28 BD 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
Default Photo
11-28FSV23-BD-16
RFQ
1,875
In-stock
 Leader Tech Inc. 0.11 X 0.28 X 0.23 BD 16--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
0C97054019
0C97054019
RFQ
715
In-stock
 Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21µin (7.60µm) Adhesive
0C97054017
0C97054017
RFQ
2,850
In-stock
 Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Tin 299.21µin (7.60µm) Adhesive
0C97054002
0C97054002
RFQ
3,805
In-stock
 Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT - Active Beryllium Copper 121°C Fingerstock - 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
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