- Manufacture :
- Series :
- Operating Temperature :
- Shape :
- Plating - Thickness :
- Attachment Method :
- Applied Filters :
53 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
|
1,814
In-stock
|
Laird Technologies EMI | AP,STR,SNPB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,952
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 X 130 SN 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
|
|
777
In-stock
|
Leader Tech Inc. | .250"H X .600" X 48"L--RECTANGUL | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Rectangular | 0.250" (6.35mm) | 4.00 (1.22m) | 0.600" (15.24mm) | - | - | - | ||||
|
|
1,740
In-stock
|
Laird Technologies EMI | CSTR COIL ZNY | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
|
2,798
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 X 120 NI 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | ||||
|
|
3,271
In-stock
|
Leader Tech Inc. | .250"H X .375"W X 24"L--RECTANGU | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Rectangular | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.375" (9.53mm) | - | - | - | ||||
|
|
1,583
In-stock
|
Laird Technologies EMI | AP,STR,CDY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
604
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 X 0.50 SU 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
|
|
926
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 SU 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
|
|
3,666
In-stock
|
Leader Tech Inc. | .250"W X .250"H X 6.75"L--SQUARE | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | - | 0.250" (6.35mm) | 6.750" (171.45mm) | 0.250" (6.35mm) | - | - | - | ||||
|
|
2,885
In-stock
|
Laird Technologies EMI | CSTR COIL BF USF | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
|
|
1,576
In-stock
|
Laird Technologies EMI | CSTR COIL NIB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
|
3,976
In-stock
|
Laird Technologies EMI | CSTR COIL NIE | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
|
1,369
In-stock
|
Laird Technologies EMI | CSTR COIL SNB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
|
2,697
In-stock
|
Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | - | - | Adhesive | ||||
|
|
1,991
In-stock
|
Leader Tech Inc. | .250"H X .375"W X 24"L--D SHAPED | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | D-Shape | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.375" (9.53mm) | - | - | - | ||||
|
|
912
In-stock
|
Leader Tech Inc. | .250"H X .600"W X 10"L--RECTANGU | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Rectangular | 0.250" (6.35mm) | 10.000" (254.00mm) | 0.600" (15.24mm) | - | - | - | ||||
|
|
1,429
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 85.875 NTP--FOLDE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 7.16 (2.18m) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
|
|
2,066
In-stock
|
Leader Tech Inc. | .250"H X .375"W X 48"L--RECTANGU | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Rectangular | 0.250" (6.35mm) | 4.00 (1.22m) | 0.375" (9.53mm) | - | - | - | ||||
|
2,973
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 24MMX406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 0.375" (9.53mm) | 0.940" (23.88mm) | - | - | Hardware, Rivet, Solder | ||||
|
713
In-stock
|
Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | Active | Beryllium Copper | - | Fingerstock | - | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | - | Adhesive | ||||
|
|
1,881
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 NI 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | ||||
|
|
722
In-stock
|
Leader Tech Inc. | .250"H X .375"W X 0.40"L--D SHAP | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | D-Shape | 0.250" (6.35mm) | 0.400" (10.16mm) | 0.375" (9.53mm) | - | - | - | ||||
|
2,088
In-stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder | ||||
|
|
3,026
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.00 (7.62m) | 0.780" (19.81mm) | Unplated | - | Adhesive | ||||
|
|
2,986
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 BD 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
|
|
1,074
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 SN 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
|
|
2,255
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 SU 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||||
|
|
1,871
In-stock
|
Laird Technologies EMI | AP,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,982
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
