Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Operating Temperature Type Height Length Width Plating Plating - Thickness Attachment Method
GLOBAL STOCKS
Default Photo
RFQ
1,143
In-stock
Leader Tech Inc. 0.11 X 0.28 NI 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
Default Photo
RFQ
871
In-stock
Leader Tech Inc. 0.11 X 0.28 X 0.24 NI 16.0--FOLD - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
Default Photo
RFQ
1,348
In-stock
Leader Tech Inc. 0.11 X 0.28 NI 16--FOLDED SERIES - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
Default Photo
RFQ
2,928
In-stock
Laird Technologies EMI AP,STR,NIB,PSA - Active Beryllium Copper 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
3,451
In-stock
Laird Technologies EMI AP,STR,NIE,PSA - Active Beryllium Copper 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
3,991
In-stock
Laird Technologies EMI AP,STR,NID,PSA - Active Beryllium Copper 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21µin (7.60µm) Adhesive
0C97054019
RFQ
715
In-stock
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT - Active Beryllium Copper 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel 299.21µin (7.60µm) Adhesive
Default Photo
RFQ
1,734
In-stock
Leader Tech Inc. 0.11 X 0.28 NI 16 NTP--FOLDED SE - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive
Default Photo
RFQ
1,534
In-stock
Leader Tech Inc. 0.11 X 0.28 X 0.23 NI 16--FOLDED - Active Beryllium Copper -55°C ~ 121°C Fingerstock 0.110" (2.79mm) 16.000" (406.40mm) 0.280" (7.11mm) Nickel Flash Adhesive