- Series :
- Width :
-
- 0.160" (4.06mm) (6)
- 0.195" (4.95mm) (1)
- 0.200" (5.08mm) (2)
- 0.210" (5.33mm) (2)
- 0.230" (5.84mm) (30)
- 0.260" (6.60mm) (1)
- 0.300" (7.62mm) (5)
- 0.320" (8.13mm) (2)
- 0.340" (8.64mm) (16)
- 0.500" (12.70mm) (2)
- 0.600" (15.24mm) (8)
- 0.670" (17.02mm) (1)
- 0.760" (19.30mm) (4)
- 0.780" (19.81mm) (5)
- 0.980" (24.89mm) (1)
- Attachment Method :
- Applied Filters :
74 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||
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3,614
In-stock
|
Laird Technologies EMI | TWT,STR,CDY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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1,902
In-stock
|
Laird Technologies EMI | AP,STR,CDC,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Cadmium + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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1,814
In-stock
|
Laird Technologies EMI | AP,STR,SNPB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
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674
In-stock
|
Laird Technologies EMI | TWT,STR,SNPB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,715
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,629
In-stock
|
Laird Technologies EMI | TWT,STR,SNPB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,583
In-stock
|
Laird Technologies EMI | AP,STR,CDY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
1,313
In-stock
|
Laird Technologies EMI | TWT,STR,NIB,PSA,POR | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
2,423
In-stock
|
Laird Technologies EMI | TWT,STR,ZNY,PSA,POR | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
733
In-stock
|
Laird Technologies EMI | CLO,STR,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.400" (10.16mm) | 24.000" (609.60mm) | 0.980" (24.89mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
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3,483
In-stock
|
Laird Technologies EMI | CLO,STR,DLN,SNSAT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
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3,559
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.310" (7.87mm) | 24.000" (609.60mm) | 0.670" (17.02mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,851
In-stock
|
Laird Technologies EMI | CLO,STR,DLN,SNB,USF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.210" (5.33mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
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2,292
In-stock
|
Laird Technologies EMI | NOSG,STR,SNSAT,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,650
In-stock
|
Laird Technologies EMI | TWT COIL ZNC PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
3,105
In-stock
|
Laird Technologies EMI | TWT COIL NIE PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
3,298
In-stock
|
Laird Technologies EMI | TWT COIL SNB USF PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,648
In-stock
|
Laird Technologies EMI | TWT COIL SNSAT USFT PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,579
In-stock
|
Laird Technologies EMI | HDWE GROUNDING STRIP | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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846
In-stock
|
Laird Technologies EMI | NOSG, STR,NIB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,080
In-stock
|
Laird Technologies EMI | TWT COIL ZNC USFT PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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1,822
In-stock
|
Laird Technologies EMI | TWT COIL SNB PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,321
In-stock
|
Laird Technologies EMI | NOSG,STR,NID,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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3,320
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 4X609.6MM | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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646
In-stock
|
Laird Technologies EMI | GASKET BECU 15.24X609.6MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,569
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 8.64X609.6MM | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
3,831
In-stock
|
Laird Technologies EMI | TWT,STR,SNSAT,PSA,POR | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,191
In-stock
|
Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | 299.21µin (7.60µm) | Adhesive | ||||
|
1,189
In-stock
|
Laird Technologies EMI | TWT,STR,SNB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,415
In-stock
|
Laird Technologies EMI | TWT,STR,ZNC,USFT,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive |