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10 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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3,125
In-stock
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Laird Technologies EMI | CLO,STR,TLN,SNB,USFT | Clip-On | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
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2,889
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 0.347" (8.81mm) | 0.600" (15.24mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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1,650
In-stock
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Laird Technologies EMI | TWT COIL ZNC PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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1,531
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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3,036
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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698
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,905
In-stock
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Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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1,117
In-stock
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Laird Technologies EMI | SLMT,6F,BF,USFT | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 0.980" (24.89mm) | 0.310" (7.87mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
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3,213
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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1,853
In-stock
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Laird Technologies EMI | GASKET BECU 9.65X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
