- Width :
-
- 0.150" (3.81mm) (2)
- 0.160" (4.06mm) (6)
- 0.200" (5.08mm) (2)
- 0.230" (5.84mm) (29)
- 0.260" (6.60mm) (2)
- 0.280" (7.11mm) (9)
- 0.300" (7.62mm) (5)
- 0.320" (8.13mm) (5)
- 0.340" (8.64mm) (16)
- 0.350" (8.89mm) (5)
- 0.370" (9.40mm) (11)
- 0.380" (9.65mm) (6)
- 0.450" (11.43mm) (18)
- 0.500" (12.70mm) (2)
- 0.510" (12.95mm) (3)
- 0.600" (15.24mm) (9)
- 0.620" (15.75mm) (2)
- 0.670" (17.02mm) (1)
- 0.760" (19.30mm) (4)
- 0.780" (19.81mm) (7)
- 1.130" (28.70mm) (3)
- Applied Filters :
143 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
|
3,614
In-stock
|
Laird Technologies EMI | TWT,STR,CDY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,902
In-stock
|
Laird Technologies EMI | AP,STR,CDC,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Cadmium + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,814
In-stock
|
Laird Technologies EMI | AP,STR,SNPB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
674
In-stock
|
Laird Technologies EMI | TWT,STR,SNPB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
677
In-stock
|
Laird Technologies EMI | GASKET BECU 28.7X304.8MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,715
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,700
In-stock
|
Laird Technologies EMI | AP,STR,SNSAT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,629
In-stock
|
Laird Technologies EMI | TWT,STR,SNPB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,583
In-stock
|
Laird Technologies EMI | AP,STR,CDY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,313
In-stock
|
Laird Technologies EMI | TWT,STR,NIB,PSA,POR | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,423
In-stock
|
Laird Technologies EMI | TWT,STR,ZNY,PSA,POR | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,559
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.310" (7.87mm) | 24.000" (609.60mm) | 0.670" (17.02mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
952
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,204
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,545
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,374
In-stock
|
Laird Technologies EMI | NOSG,STR,ZNC,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
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1,119
In-stock
|
Laird Technologies EMI | AP COIL NIB PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,889
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 0.347" (8.81mm) | 0.600" (15.24mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
618
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,835
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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|
753
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,422
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,292
In-stock
|
Laird Technologies EMI | NOSG,STR,SNSAT,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.220" (5.59mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,650
In-stock
|
Laird Technologies EMI | TWT COIL ZNC PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,105
In-stock
|
Laird Technologies EMI | TWT COIL NIE PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
|
1,411
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,298
In-stock
|
Laird Technologies EMI | TWT COIL SNB USF PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
2,648
In-stock
|
Laird Technologies EMI | TWT COIL SNSAT USFT PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,579
In-stock
|
Laird Technologies EMI | HDWE GROUNDING STRIP | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
846
In-stock
|
Laird Technologies EMI | NOSG, STR,NIB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
