- Manufacture :
- Series :
- Operating Temperature :
- Plating - Thickness :
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12 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
|
3,715
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
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2,813
In-stock
|
Leader Tech Inc. | 0.23 X 0.60 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
|
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3,579
In-stock
|
Laird Technologies EMI | HDWE GROUNDING STRIP | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
646
In-stock
|
Laird Technologies EMI | GASKET BECU 15.24X609.6MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,246
In-stock
|
Leader Tech Inc. | 0.23 X 0.60 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
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3,989
In-stock
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Laird Technologies EMI | AP COIL SNB PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
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3,555
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
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3,333
In-stock
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Leader Tech Inc. | 0.23 X 0.76 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | Flash | Adhesive | ||||
|
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808
In-stock
|
Leader Tech Inc. | 0.23 X 0.60 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
|
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2,780
In-stock
|
Leader Tech Inc. | 0.23 X 0.60 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | Flash | Adhesive | ||||
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2,607
In-stock
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Laird Technologies EMI | FLX,STR,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Snap-In | ||||
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2,854
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
