- Manufacture :
- Series :
- Operating Temperature :
- Plating - Thickness :
- Attachment Method :
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10 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
|
1,952
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 X 130 SN 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
|
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1,369
In-stock
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Laird Technologies EMI | CSTR COIL SNB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
|
713
In-stock
|
Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | Active | Beryllium Copper | - | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | - | Adhesive | ||||
|
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1,074
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 SN 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
|
|
1,982
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
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1,761
In-stock
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Laird Technologies EMI | AP,STR,SNSAT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
|
3,336
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive | ||||
|
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2,183
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 X 0.50 SN 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive | ||||
|
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3,428
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||||
|
|
1,890
In-stock
|
Laird Technologies EMI | AP,STR,SNB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 12.000" (304.80mm) | 0.780" (19.81mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
