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17 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||
|
604
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 X 0.50 SU 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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926
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 SU 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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2,885
In-stock
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Laird Technologies EMI | CSTR COIL BF USF | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
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1,429
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 85.875 NTP--FOLDE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 7.16 (2.18m) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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3,026
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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2,986
In-stock
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Leader Tech Inc. | 0.25 X 1.09 BD 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
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2,255
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 SU 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
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2,504
In-stock
|
Leader Tech Inc. | 0.25 X 1.09 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
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3,047
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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1,693
In-stock
|
Leader Tech Inc. | 0.25 X 0.78 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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1,204
In-stock
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Leader Tech Inc. | 0.25 X 0.78 X 0.50 BD 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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3,618
In-stock
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Leader Tech Inc. | 0.25 X 0.78 X 0.50 BD 24--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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1,011
In-stock
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Leader Tech Inc. | 0.25 X 1.09 X 130 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
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813
In-stock
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Leader Tech Inc. | 0.25 X 1.09 X 120 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
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1,951
In-stock
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Leader Tech Inc. | 0.25 X 1.09 X 070 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | Adhesive | ||||
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981
In-stock
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Laird Technologies EMI | AP COIL BF PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
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2,191
In-stock
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Leader Tech Inc. | 0.25 X 0.78 BD 47.625 NTP--FOLDE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 3.97 (1.21m) | 0.780" (19.81mm) | Unplated | Adhesive | ||||
